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23 Results Found

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Evolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles

Liew, Yek Ban

Author

Liew, Yek Ban, Mohd. Nasir Tamin, Goh, Teck Joo, International conference on Electronic Materials and Packaging Conference (6th. : 2004 : Pulau Pinang)

Format:

Call Number

TS610 L53 2004

Publisher

Universiti Teknologi Malaysia,

Publication Date

2004

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Cover image for Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold

Ng, Mei Wah, 1986-

Author

Ng, Mei Wah, 1986-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal

Format:

Call Number

Publication Date

2010

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010

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Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold

Ng, Mei Wah, 1986-

Author

Ng, Mei Wah, 1986-

Format:

Call Number

CP 030484 ra

Publication Date

2010

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010

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Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish

Nor Diyana Mutalif, 1985-

Author

Nor Diyana Mutalif, 1985-

Format:

Call Number

CP 029716 ra

Publication Date

2008

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008

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Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish

Nor Diyana Mutalif, 1985-

Author

Nor Diyana Mutalif, 1985-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal

Format:

Call Number

TK7870.15 N67 2008 raf

Publication Date

2008

Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008

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Evaluation of different lead free solders : a study on intermetallics

Lim, Chong Kheng

Author

Lim, Chong Kheng

Format:

Call Number

CP 10915

Publisher

Universiti Teknologi Malaysia,

Publication Date

2006

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006

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Evaluation of different lead free solders : a study on intermetallics

Lim, Chong Kheng

Author

Lim, Chong Kheng

Format:

Call Number

TS226 L55 2006

Publisher

Universiti Teknologi Malaysia,

Publication Date

2006

Full text

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006

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Deformation response of lead-free solder

Koh, Ching Theng

Author

Koh, Ching Theng

Format:

Call Number

CP 4468

Publisher

Universiti Teknologi Malaysia,

Publication Date

2005

Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2005

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Numerical modeling of cyclic stress-strain behavior of Sn-Pb solder joint during thermal fatigue

Mohd. Nasir Tamin

Author

Mohd. Nasir Tamin, Liew, Yek Ban, National Seminar on Computational and Experimental Mechanics (2005 : Bangi, Selangor)

Format:

Call Number

TK7870.15 M63 2005

Publisher

Universiti Teknologi Malaysia,

Publication Date

2005

Available:
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10.

Deformation response of lead-free solder

Koh, Ching Theng

Author

Koh, Ching Theng

Format:

Call Number

TK7870.15 K63 2005

Publisher

Universiti Teknologi Malaysia,

Publication Date

2005

Full text

Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2005

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11.

Lead-free solder interconnect reliability

Shangguan, Dongkai, 1963-

Author

Shangguan, Dongkai, 1963-

Format:

Call Number

TK7870.15 L42 2005

Publisher

ASM International,

Publication Date

2005

ISBN

9780871708168

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12.

Kawalan motor menggunakan labview

Mohd. Hanif Hamsan @ Kamisan

Author

Mohd. Hanif Hamsan @ Kamisan

Format:

Call Number

MFL 13193

Publisher

Universiti Teknologi Malaysia,

Publication Date

2004

Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2004

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