Title:
Development of binderless diamond grinding wheel for precision machining of the silicon die and the chip packaging on IC chips for failure analysis
Personal Author:
Series:
Siri kertas kerja penyelidikan (Universiti Teknologi Malaysia. Pusat Pengurusan Penyelidikan)
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2004
Physical Description:
[5] p. : ill. ; 29 cm.
General Note:
Vot 74065
Subject Term:
Added Author:
Added Conference Author:
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000010057785 | TJ1280 V46 2004 | Non Circulating UTM Special Collection Materials | 1:BOOK_ARC | Searching... |
Searching... | 30000010057786 | TJ1280 V46 2004 | Open Access Book | Proceedings, Conference, Workshop etc. | Searching... |
Searching... | 30000010057787 | TJ1280 V46 2004 | Open Access Book | Book | Searching... |
