Cooling of microelectronic and nanoelectronic equipment : advances and emerging research

To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

Dereje AgonaferKarl J.L. Geisler and Avram Bar-CohenBing Shi and Ankur SrivastavaDavid CopelandClemens J.M. LasanceMehmet Arik and Enes TamdoganPeng WangKazuaki Yazawal and Andrei Fedorov and Yogendra Joshi and Ali ShakouriAmy S. FleischerMasaru Ishizuka and Tomoyuki HatakeyamaKarthik K. Bodla and Jayathi Y. Murthy and Suresh V. GarimellaGlen A. Powell and Anuradha Bulusu and Justin A. Weibel and Sungwon S. Kim and Suresh V. Garimella and Timothy S. FisherQihong Nie and Yogendra JoshiJun Dai and Michael Ohadi and Michael PechtPradeep Lall and Mahendra Harsha and Kai Goebel and Jim JonesAvram Bar-Cohen

Dedication	p. v
1 A Review of Cooling Road Maps for 3D Chip Packages	p. 1
2 Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks	p. 19
3 Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency	p. 43
4 Energy Reduction and Performance Maximization Through Improved Cooling	p. 69
5 Optimal Choice of Heat Sinks from an Industrial Point of View	p. 83
6 Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems	p. 125
7 Recent Advance in Thermoelectric Devices for Electronics Cooling	p. 167
8 Energy Efficient Solid-State Cooling for Hot Spot Removal	p. 195
9 An Overview of the Use of Phase Change Materials for the Thermal Management of Transient Portable Electronics: Benefits and Challenges	p. 227
10 Estimation of Cooling Performance of Phase Change Material (PCM) Module	p. 243
11 Optimization Under Uncertainty for Electronics Cooling Design	p. 267
12 Hydrophilic CNT-Sintered Copper Composite Wick for Enhanced Cooling	p. 307
13 A Cabinet Level Thermal Test Vehicle to Evaluate Hybrid Double_Sided Cooling Schemes	p. 333
14 Energy Efficiency and Reliability Risk Mitigation of Data Centers Through Prognostics and Health Management	p. 357
15 Damage Pre-Cunsors Based Assessment of Accrued Thermo-mechanical Damage and Remaining Useful Life in Field Deployed Electronics	p. 377
16 Towards Embedded Cooling - Gen 3 Thermal Packaging Technology	p. 421
Index	p. 459

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Table of Contents