Cover image for Development of interfacial stresses in copper-polymer dielectric dual damascene interconnect structures as a result of heating to elevated temperatures : a finite element prediction
Title:
Development of interfacial stresses in copper-polymer dielectric dual damascene interconnect structures as a result of heating to elevated temperatures : a finite element prediction
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2002
DSP_DISSERTATION:
Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2002

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30000010012995 TA418.58 M54 2002 Closed Access Thesis UTM Project Paper (Closed Access)
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