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Cover image for Electronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan
Title:
Electronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan
Series:
Solid state phenomena ; volume 273

Diffusion and defect data. Pt. B, Solid state phenomena ; volume 273
Physical Description:
xi, 409 pages : illustrations (black and white) ; 24 cm.
ISBN:
9783035713244
Abstract:
This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research. Solder, Solder Alloys, Lead-Free Solder Alloys, Interconnection, Mechanical Properties, Corrosion, Whisker Growth, Liquid Structure, Intermetallic Compounds, Solidification, Polymers, Photochemistry, Chemical Technologies, Brazing Materials Science

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30000010370109 TK7870.15 E443 2018 Open Access Book Book
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