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Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
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Searching... | 30000010370109 | TK7870.15 E443 2018 | Open Access Book | Book | Searching... |
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Summary
Summary
This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.
Table of Contents
The Interaction of Sn-Ga Alloys and Au Coated Cu Substrates | p. 3 |
Effect of Trace Phosphorus on the Dross Formation in Tin-Copper-Nickel Wave Solder | p. 9 |
Formation of Cu6Sn5/(Cu, Ni)6Sn5 Intermetallic Compounds between Cu3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding | p. 14 |
Grain Refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu High Temperature Solder Alloys | p. 20 |
Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy | p. 27 |
Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review | p. 34 |
Influence of Bismuth in Sn-Based Lead-Free Solder - A Short Review | p. 40 |
Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution | p. 46 |
Corrosion of Sn-Zn-Bi Lead Free Solder in KOH Electrolyte | p. 51 |
Corrosion Performance of Sn-9Zn and Sn-0.7Cuin 3.5% NaCl Solution | p. 56 |
Effect of Phosphorus and Nickel on Electrochemical Migration of Sn-3Ag-0.7Cu Solder Paste in Simulated Body Fluid | p. 61 |
Synchrotron Radiography of Sn-0.7Cu-0.05Ni Solder Solidification | p. 66 |
Tensile Properties of Sn-Bi Lead-Free Solder Alloys | p. 72 |
Effect of Surface Potential Distribution on Corrosion Behavior of SnAgCu Solder/Cu Substrate Interface | p. 77 |
Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens | p. 83 |
Microstructure and Phase Analyses on the Corrosion of SAC305 Solder in Na#1057;l Solution | p. 91 |
STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds | p. 95 |
Effect of Trace Elements on the Liquid Structure of Sn-Cu Alloys Investigated by High Energy X-Ray Diffraction | p. 101 |
Preliminary Study on Deformation and Recrystallization Behavior of Pure Tin for Mitigation of Whisker Growth | p. 107 |
Palladium(II) Picoline Thiourea Complex as Homogenous Catalyst in Heck Cross-Coupling Reaction in the Formation of C=C Bond | p. 115 |
Aloe Vera Liquid Crystal Emulsion and Characterization of its Physical Properties | p. 122 |
Diffractografic Analysis of AISI 420 Steel | p. 128 |
Synthesis, Characterization and Crystal Structure of Coordination Polymers Developed as Anion Receptor | p. 134 |
Synthesis and Characterization of Ag/TiO2 Thin Film via Sol-Gel Method | p. 140 |
The Effect of Temperature on Anatase TiO2 Photoanode for Dye Sensitized Solar Cell | p. 146 |
Manganese Substituted Iron Titanate Particles with Enhancement Adsorption Capacity for Removal of Remazol Brilliant Blue R Dye | p. 154 |
Evaluation of ICP-OES Method for Heavy Metal and Metalloids Determination in Sterile Dump Material | p. 159 |
The Formation and Properties of Zeolite-A and Zeolite-X through Geopolymerisation of Metakaolin | p. 167 |
Effect of Geopolymer Coating on Mild Steel | p. 175 |
Wettability of Sn-Ti Alloys on Poly-Crystalline CVD Diamond Plates | p. 181 |
Brazing Sapphire/Sapphire and Sapphire/Copper Sandwich Joints Using Sn-Ag-Ti Active Solder Alloy | p. 187 |