Cover image for Quality improvement of solder paste printing process using six sigma methodology
Title:
Quality improvement of solder paste printing process using six sigma methodology
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Publication Information:
Skudai : Universiti Teknologi Malaysia, 2005
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1v + 1 CD-ROM
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Also available in compact disc version : CP 4493 ra
Electronic Access:
Full text
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005

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30000010094793 TS156 W664 2005 Closed Access Thesis UTM Project Paper (Closed Access)
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