Title:
Quality improvement of solder paste printing process using six sigma methodology
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2005
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version : TS156 W664 2005
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
---|---|---|---|---|---|
Searching... | 30000010094791 | CP 4493 | UTM Special Collection - Computer File | Compact Disc Accompanies UTM Thesis/Project Paper | Searching... |