In high technology industries today, Integrated Circuit Chips have become one of the essential products needed to ensure competitiveness in computerized and automation system. In order to maintain competitive edge in this industries the need to buil a quality and precision mould for the integrated circuit (I.C.) chips become very important. Transfer moulding techniques for production of components in semiconductors is a popular process. This state-of-the-art technology is much seek for in today moulding industries. In this project an I.C. Mould is design based on one of the technique as mentioned above. The working principle of I.C. Mould are studied, reviewed and analyzed. The design of an I.C. Mould involves several areas which are literature study,detail design and calculations and lastly fabrication work. In this projectonly the first two areas are partly conducted and documented. Nevertheless this thesis emphasize on the use of Smartcam to assit in the fabrication work for future mould development.