Cover image for Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes
Title:
Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes
Publication Information:
2008
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version : TK7870.15 S62 2008 raf

Supervisor : Assoc. Prof. Dr Ali Ourdjini
Subject Term:
Added Corporate Author:
DSP_DISSERTATION:
Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2008

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30000010188380 CP 017133 ra UTM Special Collection - Computer File Compact Disc Accompanies UTM Thesis/Project Paper
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