Title:
Electronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan
Series:
Solid state phenomena ; volume 273
Diffusion and defect data. Pt. B, Solid state phenomena ; volume 273
Physical Description:
xi, 409 pages : illustrations (black and white) ; 24 cm.
ISBN:
9783035713244
Abstract:
This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research. Solder, Solder Alloys, Lead-Free Solder Alloys, Interconnection, Mechanical Properties, Corrosion, Whisker Growth, Liquid Structure, Intermetallic Compounds, Solidification, Polymers, Photochemistry, Chemical Technologies, Brazing Materials Science
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000010370109 | TK7870.15 E443 2018 | Open Access Book | Book | Searching... |
On Order
Summary
Summary
This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.
Table of Contents
| The Interaction of Sn-Ga Alloys and Au Coated Cu Substrates | p. 3 |
| Effect of Trace Phosphorus on the Dross Formation in Tin-Copper-Nickel Wave Solder | p. 9 |
| Formation of Cu6Sn5/(Cu, Ni)6Sn5 Intermetallic Compounds between Cu3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding | p. 14 |
| Grain Refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu High Temperature Solder Alloys | p. 20 |
| Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy | p. 27 |
| Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review | p. 34 |
| Influence of Bismuth in Sn-Based Lead-Free Solder - A Short Review | p. 40 |
| Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution | p. 46 |
| Corrosion of Sn-Zn-Bi Lead Free Solder in KOH Electrolyte | p. 51 |
| Corrosion Performance of Sn-9Zn and Sn-0.7Cuin 3.5% NaCl Solution | p. 56 |
| Effect of Phosphorus and Nickel on Electrochemical Migration of Sn-3Ag-0.7Cu Solder Paste in Simulated Body Fluid | p. 61 |
| Synchrotron Radiography of Sn-0.7Cu-0.05Ni Solder Solidification | p. 66 |
| Tensile Properties of Sn-Bi Lead-Free Solder Alloys | p. 72 |
| Effect of Surface Potential Distribution on Corrosion Behavior of SnAgCu Solder/Cu Substrate Interface | p. 77 |
| Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens | p. 83 |
| Microstructure and Phase Analyses on the Corrosion of SAC305 Solder in Na#1057;l Solution | p. 91 |
| STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds | p. 95 |
| Effect of Trace Elements on the Liquid Structure of Sn-Cu Alloys Investigated by High Energy X-Ray Diffraction | p. 101 |
| Preliminary Study on Deformation and Recrystallization Behavior of Pure Tin for Mitigation of Whisker Growth | p. 107 |
| Palladium(II) Picoline Thiourea Complex as Homogenous Catalyst in Heck Cross-Coupling Reaction in the Formation of C=C Bond | p. 115 |
| Aloe Vera Liquid Crystal Emulsion and Characterization of its Physical Properties | p. 122 |
| Diffractografic Analysis of AISI 420 Steel | p. 128 |
| Synthesis, Characterization and Crystal Structure of Coordination Polymers Developed as Anion Receptor | p. 134 |
| Synthesis and Characterization of Ag/TiO2 Thin Film via Sol-Gel Method | p. 140 |
| The Effect of Temperature on Anatase TiO2 Photoanode for Dye Sensitized Solar Cell | p. 146 |
| Manganese Substituted Iron Titanate Particles with Enhancement Adsorption Capacity for Removal of Remazol Brilliant Blue R Dye | p. 154 |
| Evaluation of ICP-OES Method for Heavy Metal and Metalloids Determination in Sterile Dump Material | p. 159 |
| The Formation and Properties of Zeolite-A and Zeolite-X through Geopolymerisation of Metakaolin | p. 167 |
| Effect of Geopolymer Coating on Mild Steel | p. 175 |
| Wettability of Sn-Ti Alloys on Poly-Crystalline CVD Diamond Plates | p. 181 |
| Brazing Sapphire/Sapphire and Sapphire/Copper Sandwich Joints Using Sn-Ag-Ti Active Solder Alloy | p. 187 |
