Cover image for Application of six sigma methodology in reducing solder paste wastage
Title:
Application of six sigma methodology in reducing solder paste wastage
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Publication Information:
2009
Physical Description:
xxi, 98 p. : ill. ; 30 cm.
General Note:
Supervisor : Prof. Dr. Noordin Mohd. Yusof

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Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2009

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FKM30000004243 XX(797275.1) Closed Access Thesis UTM Project Paper (Open Shelves)
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