Title:
Quality improvement of the wire bonding process in a semi conductor company
Personal Author:
Publication Information:
2011
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version : HD62.15 N49 2011 raf
Supervisor : Assoc. Prof. Dr. Wong Kuan Yew
Subject Term:
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Industri)) - Universiti Teknologi Malaysia, 2011
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 774081-2002 | XX(774081.1) | UTM Special Collection - Computer File | Compact Disc Accompanies UTM Thesis/Project Paper | Searching... |
Searching... | 30000010269488 | CP 055314 ra | UTM Special Collection - Computer File | Compact Disc Accompanies UTM Thesis/Project Paper | Searching... |
