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Cover image for Fundamentals of arc welding
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Cover image for Strain-engineered MOSFETs
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Cover image for Analog IC reliability in nanometer CMOS
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Cover image for Reliability wearout mechanisms in advanced CMOS technologies
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Cover image for Transient-induced latchup in CMOS integrated circuits
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Cover image for Advanced welding and micro joining/ packaging for the 21st century : selected peer reviewed papers from the International Welding/Joining Conference-Korea 2007
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