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1. 
Cover image for Electronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan
2. 
Cover image for Metallurgy Technology and Materials VI : 6th International Conference on Metallurgy Technology and Materials (6th ICMTM 2018) : selected, peer reviewed papers from the 6th International Conference on Metallugy Technology and Materials (ICMTM2018), May 30-31, 2018, Xi'an, China
4. 
Cover image for Solid compounds of transition elements II : selected peer reviewed papers from the 18th International Conference on Solid Compounds of Transition Elements (SCTE 2012), March 31-April 5, 2012, Lisbon, Portugal
5. 
Cover image for Diffusion in solids and liquids VIII : selected, peer reviewed papers from the 8th International Conference on Diffusion in Solids and Liquids : mass transfer, heat transfer, microstructure & properties, nanodiffusion and nanostructured materials (DSL-2012), June 25-29, 2012, Istanbul, Turkey
7. 
Cover image for Diffusion in solids and liquids V : selected, peer reviewed papers from the 5th International Conference on Diffusion in Solids and Liquids, Mass Transfer, Heat Transfer, Microstructure & Properties, Nanodiffusion and Nano structured Materials, DSL-2009, 24-26 June 2009, Grand Hotel Palazzo Carpegna Rome, Italy
9. 
Cover image for Smart materials for smart devices and structures : selected, peer reviewed papers from the symposium C, European Materials Research Society, Fall meeting, Warsaw University of Technology, September 15-19, 2008
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Cover image for Air pollution modeling and its application XIX