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49. 
Cover image for ISTFA 2013 : conference proceedings from the 39th International Symposium for Testing and Failure Analysis, November 3-7, 2013, San Jose Convention Center, San Jose, California, USA
50. 
Cover image for Design and simulation of half-bridge power supply
51. 
Cover image for 17th edition IET wiring regulations : design and verification of electrical installations
52. 
Cover image for Embedded security module for high frequency messenger system
53. 
Cover image for Development of switch mode power supply for gel electrophoresis unit
54. 
Cover image for Brilliant LED projects : 20 electronic designs for artists, hobbyists, and experimenters
55. 
Cover image for Polymers for electricity and electronics : materials, properties, and applications
56. 
Cover image for E-waste : management, types and challenges
57. 
Cover image for Gaseous electronics : tables, atoms, and molecules
58. 
Cover image for Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
59. 
Cover image for Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
60. 
Cover image for Electronic devices : conventional current version
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