Search Results for Packaging

Skip to:Search Results

|

|

|

Limit Search Results

Switch to list view

Switch to thumbnail view

2 Results Found

Subscribe to search results

1

00MAIN

Print

1.

Cover image for Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC

Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC

by

Li, Er-Ping

Author

Li, Er-Ping

Format:

Call Number

TK7874.893 L53 2012

Publisher

Wiley-IEEE Press,

Publication Date

2012

ISBN

9780470623466

Available:
Holds:
Copies:

2.

Cover image for Design and modeling for 3D ICs and interposers

Design and modeling for 3D ICs and interposers

by

Swaminathan, Madhavan, author

Author

Swaminathan, Madhavan, author, Han, Ki Jin, author

Format:

Call Number

TK7874.893 S93 2014

Publisher

World Scientific,

Publication Date

2014

ISBN

9789814508599

Available:
Holds:
Copies:

1

Go to:Search Results

|

|