Search Results for - Narrowed by: Ali Ourdjini - Fakulti Kejuruteraan Mekanikal - Intermetallic compoundsSirsiDynix Enterprisehttp://portal.utm.my/client/en_AU/main/main/qf$003dAUTHOR$002509Author$002509Ali$002bOurdjini$002509Ali$002bOurdjini$0026qf$003dAUTHOR$002509Author$002509Fakulti$002bKejuruteraan$002bMekanikal$002509Fakulti$002bKejuruteraan$002bMekanikal$0026qf$003dSUBJECT$002509Subject$002509Intermetallic$002bcompounds$002509Intermetallic$002bcompounds$0026ps$003d300$0026isd$003dtrue?dt=list2024-06-26T21:43:00ZInterfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishesent://SD_ILS/0/SD_ILS:7906142024-06-26T21:43:00Z2024-06-26T21:43:00Zby Saliza Azlina Osman, 1982-<br/>Author Saliza Azlina Osman, 1982-, Ali Ourdjini, Astuty Amrin, supervisor, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TJ243 S25 2012 raf<br/>Publication Date 2012<br/>Thesis (Doktor Falsafah (Kejuruteraan Mekanikal)) - Universiti Teknologi Malaysia, 2012<br/>Formation of intermetallic compound between Sn-Ag-Cu solders and direct immersion gold (DIG) surface finishent://SD_ILS/0/SD_ILS:7741722024-06-26T21:43:00Z2024-06-26T21:43:00Zby Chia, Xing Nian, 1987-<br/>Author Chia, Xing Nian, 1987-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number XX(774172.1)<br/>Publication Date 2011<br/>Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011<br/>Formation of intermetallic compound between Sn-Ag-Cu solders and direct immersion gold (DIG) surface finishent://SD_ILS/0/SD_ILS:7741732024-06-26T21:43:00Z2024-06-26T21:43:00Zby Chia, Xing Nian, 1987-<br/>Author Chia, Xing Nian, 1987-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number XX(774173.1)<br/>Publication Date 2011<br/>Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011<br/>Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finishent://SD_ILS/0/SD_ILS:6449082024-06-26T21:43:00Z2024-06-26T21:43:00Zby Tan, Luyeen, 1986-<br/>Author Tan, Luyeen, 1986-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number XX(644908.2)<br/>Publication Date 2010<br/>Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010<br/>Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion goldent://SD_ILS/0/SD_ILS:6437002024-06-26T21:43:00Z2024-06-26T21:43:00Zby Ng, Mei Wah, 1986-<br/>Author Ng, Mei Wah, 1986-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number x<br/>Publication Date 2010<br/>Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010<br/>Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finishent://SD_ILS/0/SD_ILS:6449322024-06-26T21:43:00Z2024-06-26T21:43:00Zby Chin, Ee Mei, 1986-<br/>Author Chin, Ee Mei, 1986-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TN690 C45 2010 raf<br/>Publication Date 2010<br/>Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010<br/>Intermetallic compound (IMC) formation in lead free soldering on immersion silver finishent://SD_ILS/0/SD_ILS:3721492024-06-26T21:43:00Z2024-06-26T21:43:00Zby Chua, Chai Ying, 1985-<br/>Author Chua, Chai Ying, 1985-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TS610 C48 2009 raf<br/>Publication Date 2009<br/>Project Paper (Sarjana Muda Kejuruteraan (Mekanikal-Bahan)) - Universiti Teknologi Malaysia, 2009<br/>Study of intermetallic compound formation during soldering on Cu-Ni Pd finishent://SD_ILS/0/SD_ILS:3414962024-06-26T21:43:00Z2024-06-26T21:43:00Zby Ang, Pei Ling<br/>Author Ang, Pei Ling, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TS610 A54 2008 raf<br/>Publication Date 2008<br/>Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008<br/>Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finishent://SD_ILS/0/SD_ILS:3426812024-06-26T21:43:00Z2024-06-26T21:43:00Zby Noor Afzan Muhamad, 1985-<br/>Author Noor Afzan Muhamad, 1985-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TN690 N66 2008 raf<br/>Publication Date 2008<br/>Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008<br/>Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finishent://SD_ILS/0/SD_ILS:2849462024-06-26T21:43:00Z2024-06-26T21:43:00Zby Liew, Chung Wah<br/>Author Liew, Chung Wah, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TN690 L54 2007 raf<br/>Publication Date 2007<br/>Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007<br/>Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishesent://SD_ILS/0/SD_ILS:2649802024-06-26T21:43:00Z2024-06-26T21:43:00Zby Nor Akmal Fadil<br/>Author Nor Akmal Fadil, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TN690 N67 2007 raf<br/>Publication Date 2007<br/>Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2007<br/>Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishesent://SD_ILS/0/SD_ILS:2636832024-06-26T21:43:00Z2024-06-26T21:43:00Zby Azizah Wahi<br/>Author Azizah Wahi, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TN690 A95 2007 raf<br/>Publication Date 2007<br/>Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007<br/>Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finishent://SD_ILS/0/SD_ILS:1599232024-06-26T21:43:00Z2024-06-26T21:43:00Zby Siti Rabiatull Aisha Idris<br/>Author Siti Rabiatull Aisha Idris, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TS610 S58 2006<br/>Publication Date 2006<br/>Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2006<br/>