Search Results for Electrolysis - Narrowed by: Electronic packagingSirsiDynix Enterprisehttp://portal.utm.my/client/en_AU/main/main/qu$003dElectrolysis$0026qf$003dSUBJECT$002509Subject$002509Electronic$002bpackaging$002509Electronic$002bpackaging$0026ps$003d300?dt=list2024-06-04T15:58:25ZEffect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion goldent://SD_ILS/0/SD_ILS:6437002024-06-04T15:58:25Z2024-06-04T15:58:25Zby Ng, Mei Wah, 1986-<br/>Author Ng, Mei Wah, 1986-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number x<br/>Publication Date 2010<br/>Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010<br/>Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion goldent://SD_ILS/0/SD_ILS:6437032024-06-04T15:58:25Z2024-06-04T15:58:25Zby Ng, Mei Wah, 1986-<br/>Author Ng, Mei Wah, 1986-<br/>Format: Books<br/>Call Number CP 030484 ra<br/>Publication Date 2010<br/>Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010<br/>Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishesent://SD_ILS/0/SD_ILS:5914342024-06-04T15:58:25Z2024-06-04T15:58:25Zby Siti Rabiatull Aisha Idris, 1983-<br/>Author Siti Rabiatull Aisha Idris, 1983-, Fakulti Kejuruteraan Mekanikal<br/>Format: Computer file<br/>Call Number CP 017133 ra<br/>Publication Date 2008<br/>Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2008<br/>Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishesent://SD_ILS/0/SD_ILS:3296742024-06-04T15:58:25Z2024-06-04T15:58:25Zby Siti Rabiatull Aisha Idris, 1983-<br/>Author Siti Rabiatull Aisha Idris, 1983-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TK7870.15 S62 2008 raf<br/>Publication Date 2008<br/>Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2008<br/>Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishesent://SD_ILS/0/SD_ILS:8199272024-06-04T15:58:25Z2024-06-04T15:58:25Zby Ali Ourdjini, author<br/>Author Ali Ourdjini, author, Universiti Teknologi Malaysia. Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TK7870.15 A456 2011 af<br/>ISBN 9789673537877<br/>