Search Results for Joints (Engineering) - Narrowed by: Electronic apparatus and appliances -- Reliability
SirsiDynix Enterprise
http://portal.utm.my/client/en_AU/main/main/qu$003dJoints$002b$002528Engineering$002529$0026qf$003dSUBJECT$002509Subject$002509Electronic$002bapparatus$002band$002bappliances$002b--$002bReliability$002509Electronic$002bapparatus$002band$002bappliances$002b--$002bReliability$0026ic$003dtrue$0026ps$003d300?dt=list
2024-05-01T16:39:42Z
Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
ent://SD_ILS/0/SD_ILS:819069
2024-05-01T16:39:42Z
2024-05-01T16:39:42Z
by Aliff Farhan Mohd. Yamin, 1986-<br/>Author Aliff Farhan Mohd. Yamin, 1986-, Mohd. Nasir Tamin, supervisor, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TK7870.15 A45 2012 raf<br/>Publication Date 2012<br/>Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012<br/>
Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
ent://SD_ILS/0/SD_ILS:819070
2024-05-01T16:39:42Z
2024-05-01T16:39:42Z
by Aliff Farhan Mohd. Yamin, 1986-<br/>Author Aliff Farhan Mohd. Yamin, 1986-<br/>Format: Books<br/>Call Number CP 031876 ra<br/>Publication Date 2012<br/>Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012<br/>
Classical and damage mechanics-based models for lead-free solder interconnects
ent://SD_ILS/0/SD_ILS:603180
2024-05-01T16:39:42Z
2024-05-01T16:39:42Z
by Lai, Zheng Bo, 1984-<br/>Author Lai, Zheng Bo, 1984-, Fakulti Kejuruteraan Mekanikal<br/>Format: Computer file<br/>Call Number CP 017372 ra<br/>Publication Date 2010 2009<br/>Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2009<br/>
Classical and damage mechanics-based models for lead-free solder interconnects
ent://SD_ILS/0/SD_ILS:388472
2024-05-01T16:39:42Z
2024-05-01T16:39:42Z
by Lai, Zheng Bo, 1984-<br/>Author Lai, Zheng Bo, 1984-, Mohd. Nasir Tamin, supervisor, Nazri Kamsah, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TK7870.15 L344 2009 raf<br/>Publication Date 2010 2009<br/>Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2009<br/>
Solder joint reliability prediction for multiple environments
ent://SD_ILS/0/SD_ILS:289208
2024-05-01T16:39:42Z
2024-05-01T16:39:42Z
by Perkins, Andrew E.<br/>Author Perkins, Andrew E., Sitaraman, Suresh<br/>Format: Books<br/>Call Number TK7870.15 P47 2009<br/>Publisher Springer,<br/>Publication Date 2008<br/>ISBN 9780387793931<br/>