Search Results for Joints (Engineering) - Narrowed by: Electronic apparatus and appliances -- Reliability - Closed Access Thesis
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2024-05-16T08:06:22Z
Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
ent://SD_ILS/0/SD_ILS:819069
2024-05-16T08:06:22Z
2024-05-16T08:06:22Z
by Aliff Farhan Mohd. Yamin, 1986-<br/>Author Aliff Farhan Mohd. Yamin, 1986-, Mohd. Nasir Tamin, supervisor, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TK7870.15 A45 2012 raf<br/>Publication Date 2012<br/>Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2012<br/>
Classical and damage mechanics-based models for lead-free solder interconnects
ent://SD_ILS/0/SD_ILS:388472
2024-05-16T08:06:22Z
2024-05-16T08:06:22Z
by Lai, Zheng Bo, 1984-<br/>Author Lai, Zheng Bo, 1984-, Mohd. Nasir Tamin, supervisor, Nazri Kamsah, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TK7870.15 L344 2009 raf<br/>Publication Date 2010 2009<br/>Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2009<br/>