Search Results for Lai Zheng BoSirsiDynix Enterprisehttp://portal.utm.my/client/en_AU/main/main/qu$003dLai$002bZheng$002bBo$0026ic$003dtrue$0026ps$003d300?dt=list2024-04-19T03:21:33ZEstimation of thermally-induced stesses and strains in electronics packageent://SD_ILS/0/SD_ILS:5832362024-04-19T03:21:33Z2024-04-19T03:21:33Zby Lai, Zheng Bo<br/>Author Lai, Zheng Bo<br/>Format: Computer file<br/>Call Number CP 020210 ra<br/>Publication Date 2007<br/>Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007<br/>Estimation of thermally-induced stesses and strains in electronics packageent://SD_ILS/0/SD_ILS:2628262024-04-19T03:21:33Z2024-04-19T03:21:33Zby Lai, Zheng Bo<br/>Author Lai, Zheng Bo, Nazri Kamsah, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TJ223.T4 L35 2007 raf<br/>Publication Date 2007<br/>Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007<br/>Classical and damage mechanics-based models for lead-free solder interconnectsent://SD_ILS/0/SD_ILS:6031802024-04-19T03:21:33Z2024-04-19T03:21:33Zby Lai, Zheng Bo, 1984-<br/>Author Lai, Zheng Bo, 1984-, Fakulti Kejuruteraan Mekanikal<br/>Format: Computer file<br/>Call Number CP 017372 ra<br/>Publication Date 2010 2009<br/>Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2009<br/>Classical and damage mechanics-based models for lead-free solder interconnectsent://SD_ILS/0/SD_ILS:3884722024-04-19T03:21:33Z2024-04-19T03:21:33Zby Lai, Zheng Bo, 1984-<br/>Author Lai, Zheng Bo, 1984-, Mohd. Nasir Tamin, supervisor, Nazri Kamsah, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TK7870.15 L344 2009 raf<br/>Publication Date 2010 2009<br/>Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2009<br/>Mechanics of Sn-4Ag-0.5Cu solder joints in a ball grid array assembly during reflow and temperature cyclesent://SD_ILS/0/SD_ILS:3610082024-04-19T03:21:33Z2024-04-19T03:21:33Zby Lai, Zheng Bo, 1984-, author<br/>Author Lai, Zheng Bo, 1984-, author, Nazri Kamsah, author, Loh, Wei Keat, author, Mohd. Nasir Tamin, author, International Electronics Manufacturing Technology Conference 2008 (33rd : 2008 : Pulau Pinang)<br/>Format: Books<br/>Call Number x<br/>Publisher Universiti Teknologi Malaysia,<br/>Publication Date 2008<br/>Mechanics of leaded and lead free solde joints during reflow and tempreature cyclesent://SD_ILS/0/SD_ILS:3640592024-04-19T03:21:33Z2024-04-19T03:21:33Zby Lai, Zheng Bo, 1984-, author<br/>Author Lai, Zheng Bo, 1984-, author, Nazri Kamsah, author, Mohd. Nasir Tamin, author, Conference on Manufacturing & Eleectronic Technology (2008: Johor)<br/>Format: Books<br/>Publisher Universiti Teknologi Malaysia,<br/>Publication Date 2008<br/>Advances in thermo-fluidsent://SD_ILS/0/SD_ILS:3373572024-04-19T03:21:33Z2024-04-19T03:21:33Zby Amer Nordin Aziz author<br/>Author Amer Nordin Aziz author, Azhar Abdul Aziz author, Zulkarnain Abdul Latiff author, Mazlan Said author, Mohd. Faizal Hasan, 1982-, author<br/>Format: Books<br/>Call Number TJ265 A383 2008 a<br/>Edition First edition<br/>Publisher Penerbit Universiti Teknologi Malaysia,<br/>Publication Date 2008<br/>ISBN 9789835205415<br/>