Search Results for Molding (Founding) - Narrowed by: Wire bonding (electronic packaging) -- Production control
SirsiDynix Enterprise
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2024-05-27T21:50:03Z
Advanced wirebond interconnection technology
ent://SD_ILS/0/SD_ILS:604418
2024-05-27T21:50:03Z
2024-05-27T21:50:03Z
by Prasad, Shankara K.<br/>Author Prasad, Shankara K.<br/>Format: Computer file<br/>Call Number CP 4322<br/>Publisher Kluwer Academic Publishers,<br/>Publication Date 2004<br/>ISBN 9781402077623<br/>
Advanced wirebond interconnection technology
ent://SD_ILS/0/SD_ILS:388848
2024-05-27T21:50:03Z
2024-05-27T21:50:03Z
by Prasad, Shankara K.<br/>Author Prasad, Shankara K.<br/>Format: Books<br/>Call Number TK7836 P72 2004<br/>Publisher Kluwer Academic Publishers,<br/>Publication Date 2004<br/>ISBN 9781402077623<br/>