Search Results for Packaging - Narrowed by: Ali Ourdjini - Electronic packaging

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold

2024-06-03T23:37:50Z

by Ng, Mei Wah, 1986-
Author Ng, Mei Wah, 1986-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format: Books
Call Number x
Publication Date 2010
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2010

Study of interfacial reactions between lead-free solders and immersion silver finish

2024-06-03T23:37:50Z

by Safoura Oshaghi, 1977-
Author Safoura Oshaghi, 1977-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format: Books
Call Number TK7870.15 S23 2008 raf
Publication Date 2008
Full text thesis via UTM-IR
Thesis (Sarjana Kejuruteraan (Mekanikal – Bahan)) - Universiti Teknologi Malaysia, 2008

Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish

2024-06-03T23:37:50Z

by Nor Diyana Mutalif, 1985-
Author Nor Diyana Mutalif, 1985-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format: Books
Call Number TK7870.15 N67 2008 raf
Publication Date 2008
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008

Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes

2024-06-03T23:37:50Z

by Siti Rabiatull Aisha Idris, 1983-
Author Siti Rabiatull Aisha Idris, 1983-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format: Books
Call Number TK7870.15 S62 2008 raf
Publication Date 2008
Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2008