Search Results for Packaging - Narrowed by: Mohd. Nasir Tamin, supervisorSirsiDynix Enterprisehttp://portal.utm.my/client/en_AU/main/main/qu$003dPackaging$0026qf$003dAUTHOR$002509Author$002509Mohd.$002bNasir$002bTamin$00252C$002bsupervisor$002509Mohd.$002bNasir$002bTamin$00252C$002bsupervisor$0026ps$003d300$0026isd$003dtrue?dt=list2024-06-19T09:22:58ZDevelopment of low coefficient of thermal expansion composite substrate for electronic packaging using finite element methodent://SD_ILS/0/SD_ILS:2910842024-06-19T09:22:58Z2024-06-19T09:22:58Zby Pang, Hooi San<br/>Author Pang, Hooi San, Mohd. Nasir Tamin, supervisor, Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number QD515 P36 2007 raf<br/>Publication Date 2007<br/><a href="http://eprints.utm.my/9444">Full text thesis via UTM-IR</a><br/>Thesis (Sarjana Kejuruteraan (Fakulti Kejuruteraan Mekanikal)) - Universiti Teknologi Malaysia, 2007<br/>Failure assessment of surface mount assembly under thermomechanical loading conditionsent://SD_ILS/0/SD_ILS:2888242024-06-19T09:22:58Z2024-06-19T09:22:58Zby Liew, Yek Ban<br/>Author Liew, Yek Ban, Mohd. Nasir Tamin, supervisor, Universiti Teknologi Malaysia. Fakulti Kejuruteraan Mekanikal<br/>Format: Books<br/>Call Number TK7870.23 L53 2006<br/>Publisher Universiti Teknologi Malaysia,<br/>Publication Date 2006<br/>Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2006<br/>