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Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000003904202 | TA1750 O68 1997 | Open Access Book | Book | Searching... |
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Summary
Summary
The missing link in a dynamically growing field--a state-of-the-artreference on optoelectronic packaging
The rapidly expanding field of packaging for optoelectronic deviceschallenges electrical engineers with a host of complex and dauntingproblems. The increasing intricacy of assemblage compounds thethorny interconnection issues associated with electronicpackaging-how to assemble an array with many elements efficientlywhile maintaining thermal tolerance and simultaneously overcomingthe ensuing modulation problems that generate electrical noise.Adding to these problems has been the absence, until now, of asingle authoritative reference on the subject.
Optoelectronic Packaging is the first and only comprehensivesourcebook on optoelectronic assembly techniques. Foroptoelectronic packaging experts and professionals in adjuncttechnologies, it provides an overview of today's state-of-the-arttechnologies, packages now on the drawing board, and the futuredirection of packaging types. For the novice, it lays down thefundamentals of optics and packaging. This incomparable textfeatures contributions from hands-on practitioners and,supplemented with extensive illustrations, it
* Covers detector, semiconductor laser, and optical amplifierpackaging
* Discusses waveguide technologies, free-space interconnects, andhybrid technologies
* Examines communication system interconnection structure andfiber-optic networks in telecommunications
* Explores array device packaging and flip-chip assembly for smartpixel arrays
* Includes case studies of packaged subassemblies
Author Notes
ALAN R. MICKELSON, PhD, is a faculty member of the Electrical andComputer Engineering Department of the University of Colorado,Boulder. His research area is primarily centered on integratedoptical devices for use in high-speed/microwave systems.
NAGESH R. BASAVANHALLY, PhD, is a member of the technical staff atLucent Technologies/Bell Laboratories. His research interests arein optomechanical design, packaging, and assembly-relatedactivities in electronic and optical interconnectiontechnologies.
YUNG-CHENG LEE, PhD, is an Associate Professor in the Department ofMechanical Engineering and the Associate Director of the NSF Centerfor Advanced Manufacturing and Packaging of Microwave, Optical, andDigital Electronics, University of Colorado, Boulder.
Table of Contents
| Communication System Interconnection StructureN. Yamanaka |
| Long- Distance Interconnections: The Fiber-Optic NetworkG. Grimes |
| What a Packaging Engineer Needs to Know about OpticsF. Kapron and R. Holland |
| Semiconductor Laser and Optical Amplifier PackagingS. Merritt, et al. |
| Detector PackagingL. Watkins |
| Waveguide TechnologiesR. Feuerstein |
| A Review of Passive Device Fabrication and PackagingV. Bhagavatula |
| Array Device PackagingN. Basavanhally and R. Nordin |
| Hybrid Technology for Optoelectronic PackagingP. Haugsjaa |
| Free-Space Optical Interconnect for Digital SystemsJ. Neff |
| Flip-Chip Assembly for Smart Pixel ArraysY. Lee, et al. |
| Appendix |
| References |
| Index |
