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1. 
Cover image for Electronic Packaging Interconnect Technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan
2. 
Cover image for Metallurgy Technology and Materials VI : 6th International Conference on Metallurgy Technology and Materials (6th ICMTM 2018) : selected, peer reviewed papers from the 6th International Conference on Metallugy Technology and Materials (ICMTM2018), May 30-31, 2018, Xi'an, China
3. 
Cover image for Heat and mass transfer processes : new developments and applications : special topic volume with invited peer reviewed papers only
4. 
Cover image for Solid compounds of transition elements II : selected peer reviewed papers from the 18th International Conference on Solid Compounds of Transition Elements (SCTE 2012), March 31-April 5, 2012, Lisbon, Portugal
5. 
Cover image for Diffusion in solids and liquids VIII : selected, peer reviewed papers from the 8th International Conference on Diffusion in Solids and Liquids : mass transfer, heat transfer, microstructure & properties, nanodiffusion and nanostructured materials (DSL-2012), June 25-29, 2012, Istanbul, Turkey
6. 
Cover image for Application of diamond and related materials : selected, peer reviewed papers from the 4th Conference on Application of Diamond and Related Materials in China (CADRM2010) and the 1st International Symposium on Advances in Brazed Superabrasive Tools (ISABS2010), August 19-23, 2010, Xiamen, China
7. 
Cover image for Diffusion in solids and liquids V : selected, peer reviewed papers from the 5th International Conference on Diffusion in Solids and Liquids, Mass Transfer, Heat Transfer, Microstructure & Properties, Nanodiffusion and Nano structured Materials, DSL-2009, 24-26 June 2009, Grand Hotel Palazzo Carpegna Rome, Italy
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Cover image for Smart materials for smart devices and structures : selected, peer reviewed papers from the symposium C, European Materials Research Society, Fall meeting, Warsaw University of Technology, September 15-19, 2008
11. 
Cover image for Open IT-based innovation : moving towards cooperative IT transfer and knowledge diffusion : IFIP TC8 WG 8.6 International Working Conference October 22-24, 2008, Madrid, Spain
12. 
Cover image for Air pollution modeling and its application XIX