Cover image for Defect-oriented testing for nano-metric CMOS VLSI circuits
Title:
Defect-oriented testing for nano-metric CMOS VLSI circuits
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Series:
Frontiers in electronic testing ; 34
Edition:
2nd ed.
Publication Information:
London : Springer, 2007
ISBN:
9780387465463
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Available online version
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30000010162747 TK7871.99.M44 S22 2007 Open Access Book Book
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Summary

Summary

Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent.


Table of Contents

Dedicationp. v
Prefacep. xiii
Forewordp. xvii
Foreword for the First Editionp. xix
Acknowledgementsp. xxi
Chapter 1 Introductionp. 1
1 Evolution of CMOS Technologyp. 1
2 The Test Complexityp. 5
3 Quality and Reliability Awarenessp. 9
4 Building Quality and Reliabilityp. 11
5 Objectives of this Bookp. 15
6 Book Organizationp. 16
Chapter 2 Functional and Parametric Defect Modelsp. 23
1 Brief Classification of Defectsp. 23
1.1 Defect-Fault Relationshipp. 26
2 Induetieve Fault Analysisp. 28
2.1 IC Design and Layout Related Defect Sensitivityp. 29
2.2 Defect Sensitive Designp. 29
2.3 Basic Concepts of IFAp. 30
3 Parametric Defect and Fault Modelsp. 32
3.1 Threshold Voltage Mismatch ([Delta]V[subscript t]) Fault Modelingp. 32
3.2 Sources of Threshold Voltage Variabilityp. 33
3.3 Leakage Current due to V[subscript t] Mismatchp. 34
3.4 Delay in Parallel-connected Networksp. 39
3.5 Delay Variation Model with [Delta]V[subscript t] for Parallel Transistor Networksp. 41
3.6 Spot Defect Statistics: Resistive Opensp. 45
4 Functional Defect Modelsp. 50
4.1 Critical Areasp. 53
4.2 Defect Statisticsp. 54
4.3 Average Probability of Failure of Long Interconnectsp. 58
4.4 Average Critical Area of N Conductorsp. 61
5 Conclusionsp. 64
Chapter 3 Digital CMOS Fault Modelingp. 69
1 Objectives of Fault Modelingp. 69
2 Levels of Testingp. 71
3 Levels of Fault Modelingp. 73
3.1 Logic Level Fault Modelingp. 73
3.2 Transistor Level Fault Modelingp. 81
3.3 Layout Level Fault Modelingp. 90
3.4 Function Level Fault Modelingp. 91
3.5 Delay Fault Modelsp. 92
3.6 Leakage Fault Modelp. 97
3.7 Temporary Faultsp. 98
4 Conclusionsp. 102
Chapter 4 Defects in Logic Circuits and their Test Implicationsp. 111
1 Introductionp. 111
2 Stuck-at Faults and Manufacturing Defectsp. 113
2.1 Study by Galiay, Crouzet and Vergniaultp. 114
2.2 Study by Banerjee and Abrahamp. 115
2.3 Study by Maly, Ferguson and Shenp. 120
2.4 Gate Oxide Shorts: Study by Hawkins and Sodenp. 123
3 IFA Experiments on Standard Cellsp. 126
4 I[subscript DDQ] versus Voltage Testingp. 130
5 Defects in Sequential Circuitsp. 133
5.1 Undetected Defectsp. 135
5.2 Defect Detection Techniquep. 137
5.3 I[subscript DDQ] Testable Flip-flopp. 139
5.4 Defects and Scan Chainsp. 139
6 Defect Classes and their Testingp. 143
7 Application of IFA in Nano-metric Technologiesp. 143
8 Conclusionsp. 146
Chapter 5 Testing Defects and Parametric Variations in RAMsp. 151
1 Introductionp. 151
2 Traditional RAM Fault Modelsp. 153
2.1 Stuck-at Fault Modelp. 153
2.2 Coupling Fault Modelp. 154
2.3 Pattern Sensitivity Fault Modelp. 154
3 Defect Based RAM Fault Model Developmentp. 155
3.1 Defect based SRAM Fault Models and Test Algorithmsp. 155
3.2 Subsequent Defect-oriented SRAM Test Developmentp. 160
3.3 Defect based DRAM Fault Models and Test Algorithmsp. 163
3.4 TCAM Fault Models and Test Algorithmsp. 176
4 Address Decoder Defectsp. 185
4.1 Early Work on Address Decoder Faultsp. 187
4.2 Technological Differencesp. 187
4.3 Failure and Analysisp. 189
4.4 Why Non-detection by March Tests?p. 192
4.5 Address Decoder Open Defectsp. 193
4.6 Supplementary Test Algorithmp. 195
4.7 Testability Techniques for Decoder Open Defectsp. 197
4.8 Recent Work on Address Decoder Defectsp. 200
5 Parametric Testing of SRAMsp. 200
5.1 SRAM Cell and SNMp. 203
5.2 Process Variation and SNMp. 207
5.3 Manufacturing Defects and SNMp. 209
5.4 Weak Cell Fault Modelp. 210
5.5 DfT Techniques to Detect Weak Cellsp. 211
6 I[subscript DDQ] Based RAM Testingp. 215
7 Conclusionsp. 215
Chapter 6 Defect-oriented Analog Testingp. 225
1 Introductionp. 226
2 Analog Test Complexityp. 227
3 Previous Workp. 228
3.1 Estimation Methodp. 228
3.2 Topological Methodp. 228
3.3 Taxonomical Methodp. 230
4 Defect Based Realistic Fault Dictionaryp. 230
4.1 Implementationp. 234
5 A Case Studyp. 240
5.1 Fault Matrix Generationp. 240
5.2 Stimuli Matrixp. 242
5.3 Simulation Resultsp. 243
5.4 Silicon Resultsp. 244
5.5 Observations and Analysisp. 248
5.6 IFA: Strengths and Weaknessesp. 249
6 Input Stimuli Generationp. 251
6.1 Power Supply Ramp Input Test Stimulip. 252
6.2 Amplifier Specsp. 254
6.3 Structural vs. Functional Fault Coveragep. 259
6.4 Experimental Resultsp. 264
7 IFA Based Fault Grading and DfT for Analog Circuitsp. 268
7.1 A/D Converter Testingp. 268
7.2 Description of the Experimentp. 269
7.3 Fault Simulation Issuesp. 270
7.4 Fault Simulation Resultsp. 272
8 High Level Analog Fault Modelsp. 278
9 Conclusionsp. 281
Chapter 7 Yield Engineeringp. 289
1 Mathematical Models for Yield Predictionp. 289
1.1 Layout Oriented Yield Predictionp. 300
2 Yield Engineeringp. 301
3 Economics and Yield Forecastingp. 306
4 Conclusionsp. 312
Chapter 8 Conclusionp. 317
1 Test and Yield Engineering Complexity in Nano-metric Technologiesp. 317
2 Role of Defect-oriented Testingp. 320
2.1 Strengths of Defect-oriented Testingp. 320
2.2 Limitations of Defect-oriented Testingp. 321
3 Future Directionsp. 321
Indexp. 325